KUALA LUMPUR, 5 OCTOBER 2026 – SkyeChip Berhad (“SkyeChip” or the “Company”, and together with its subsidiaries, the “Group”), a Bursa Main Market-listed integrated circuit (“IC”) design company announced today that it has joined the Rapidus Collaborative Open Rapid Ecosystem (“Rapidus CORE”) of Rapidus Corporation (“Rapidus”) as a Design Solution Associate.
Rapidus was founded in 2022 as a Japan-based semiconductor manufacturing company to produce cutting-edge 2-nanometer chips by 2027, aiming to strengthen the country’s domestic semiconductor supply and industrial competitiveness.
Rapidus CORE was established as a global ecosystem framework to support the development and mass production of cutting-edge semiconductors.
Under the collaboration, SkyeChip will contribute its advanced silicon intellectual property (“IP”) for artificial intelligence (“AI”) and high-performance computing (“HPC”) applications, together with its IC design expertise, to support customers developing next-generation AI and HPC chips on Rapidus’ process technologies.
As AI workloads grow, the speed at which data moves through and between chips has become one of the main limits on system performance, and SkyeChip’s IP is designed to address it.
The appointment places SkyeChip within Rapidus’ ecosystem for leading-edge silicon. It reflects the strength of the Group’s AI and HPC IP portfolio and its track record of delivering advanced IC design to global customers.
“Being appointed to Rapidus CORE recognises the depth of SkyeChip’s silicon IP for AI and HPC, and our engineering capability in leading-edge chip design. We look forward to working with Rapidus to help customers bring advanced AI and HPC silicon to market faster. This is an important milestone in SkyeChip’s journey to become a global silicon IP and silicon products company from Malaysia” said Dato’ Fong Swee Kiang, Chief Executive Officer of SkyeChip Berhad.